The company has made it clear technology strategy , the future will be with energy saving , environmental protection -related power integrated circuits and high-voltage power discrete devices as a core business development , vigorously develop specific technical positioned in a variety of marketable and high -tech high pressure VDMOS, high pressure and high power IGBT devices BCD fields. These long product life cycle , cost-effective and suitable for 6-inch wafer production process line .

 Product structure will gradually from the existing Metal Gate, CMOS -based transition to power DMOS, IGBT, SBD, FRD and other discrete devices and HVCMOS, BCD and other power IC chip led, in order to meet strong market demand with new power electronics requirements. The following figure shows the basic techniques FMIC cartography .

In order to achieve the target company's development strategy , the current technology is technically required under the company strategy and product development Roadmap guidelines in the technology and business portfolio , technology selection and introduction , training and other aspects of the core technical capabilities dynamically adjust the specific funds primarily in inputs, technical team and personnel training and other aspects of the introduction of a corresponding adjustment and reform , increase capital investment, accelerate technology team building, talent introduction strategies through appropriate technical team quickly upgrade the level .